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Würth Elektronik Thermal Management Solutions enable designers and engineers to control component heat. These products prevent components from overheating by providing a path for heat energy or by spreading the heat over a larger dissipation area. Thermal Management describes all methods used to take care of all the excess heat that electronic devices and components generate. It is a field of utmost importance in order to guarantee the reliability of electronic devices and components, develop robust devices, and reduce e-waste. Würth Elektronik Thermal Management Solutions improve the reliability of electronic devices and components. The portfolio includes a range of thermal management products designed to help cool electronics big and small.
WE-TGF: Thermal Gap Filler Pads are silicone elastomer gap filler pads designed to fill a gap between one or multiple electronic components and a cooling assembly, such as heating a cooling plate or metal housing. View WE-TGF Design Guideline
WE-TINS: Thermally Conductive Insulator Pads are thin silicone pads designed to electrically insulate electronic components and cooling assemblies while allowing the flow of heat. View WE-TINS Design Guideline
WE-PCM: Thermal Phase Changing Material is a phase-changing material, which is known for remaining solid at room temperature and changing into a flowing state with increasing temperature to ensure the best thermal interface. View WE-PCM Design Guideline
WE-TTT: Thermal Transfer Tape is a double-sided tape designed to provide a thermal interface, which, at the same time, allows mechanical fixing in both contact surfaces without the need for additional screws or clips. View WE-TTT Design Guideline
WE-TGFG: Graphite Foam Gaskets feature a synthetic graphite layer wrapped around a core of foam. This enables the use of a highly conductive heat spreader to fill vertical caps and provide a silicone-free alternative to the WE-TGF. View WE-TGFG Design Guideline
WE-TGS: Graphite Sheet is a synthetic graphite heat spreader. This implies that most of the thermal conductivity provided by material occurs at the horizontal or XY axis. View WE-TGS Design Guideline
