Würth Elektronik Thermal Interface Kits

Würth Elektronik Thermal Interface Kits offer a range of products for engineers to use during prototype development. The 400001 Kit is designed for vertical thermal interfaces and contains a WE-TGF Silicone Gap Filler Pad, WE-TINS Thermally Conductive Insulator, WE-PCM Phase Changing Material, and WE-TTT Thermal Transfer Tape. These products fill a gap and provide a path that allows the heat energy to flow. The 400002 Kit is designed for heat spreading interfaces and includes a WE-TGFG Graphite Foam Gasket and WE-TGS Graphite Sheet. These products help to distribute heat evenly throughout the surface of cooling assemblies. Würth Elektronik Thermal Interface Kits allows designers a variety of samples to test in designs.

Kit Contents

400001 Kit
- For vertical thermal interfaces, fills a gap and provides a path that allows the heat energy to flow
- WE-TGF Silicone Gap Filler Pad
  - 1W/mK to 10W/mK thermal conductivity
  - 0.5mm to 18mm thickness
- WE-TINS Thermally Conductive Insulator
  - K:1.6W/mK to 3.5W/mK thermal conductivity
  - 0.23mm thickness
- WE-PCM Phase Changing Material
  - 1.6W/mK to 5W/mK thermal conductivity
  - 0.2mm thickness
- WE-TTT Thermal Transfer Tape
  - 1W/mK thermal conductivity
  - 0.2mm thickness

400002 Kit
- For heat spreading interfaces, distributes heat evenly throughout the surface of cooling assemblies
- WE-TGFG Graphite Foam Gasket
  - 400W/mK thermal conductivity
  - 1.5mm to 25mm thickness
- WE-TGS Graphite Sheet
  - 1800 W/mK thermal conductivity
  - 0.03mm thickness

Würth Elektronik Thermal Interface Kits

Kit Contents

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