Vishay Semiconductors EMIPAK PressFit Power Modules

Vishay Semiconductors EMIPAK PressFit Power Modules are designed to facilitate a reliable performance in rugged 15A to 150A applications. Higher power density is achieved via integrated power components into a single housing. Several configurations of various die selections are available. Additionally, the EMIPAK modules include an integrated thermal sensor.

The Vishay Semiconductors EMIPAK PressFit Power Modules come in a 1B package with PressFit pins for ease of use. An exposed substrate and optimized layout on the package help to minimize stray parameters allowing improved performance.

Features

E series power MOSFET with fast body diode
SiC diode technology
Exposed Al2O3 substrate with low thermal resistance
Low input capacitance
Low switching and conduction losses

Low figure-of-merit (FOM) Ron x Q_g
Ultra-low gate charge Q_g
Low internal inductances
Qualified using AQG324 guideline as reference

Vishay Semiconductors EMIPAK PressFit Power Modules

Features

Package Overview

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