Transphorm TP65H070G4PS 650V SuperGaN® GaN FET

Transphorm TP65H070G4PS 650V SuperGaN® Gallium Nitride (GaN) FET is a 650V, 70mΩ normally-off device offering superior quality and performance. TP65H070G4PS combines state-of-the-art high-voltage GaN HEMT and low-voltage silicon MOSFET technologies in a 3-lead TO-220 package. Operating within a -55°C to +150°C temperature range, this component features 26W maximum power dissipation, an 18.4A to 29A maximum continuous drain current range, and 120A pulsed drain current (maximum). The Gen IV SuperGaN® platform uses advanced epi and patented design technologies to simplify manufacturability while improving efficiency over silicon via lower gate charge, output capacitance, crossover loss, and reverse recovery charge.

Features

  • Gen IV technology
  • JEDEC-qualified GaN technology
  • Dynamic RDS(on)eff production tested
  • Robust design, defined by
    • Wide gate safety margin
    • Transient over-voltage capability
  • Very low QRR
  • Reduced crossover loss
  • Achieves increased efficiency in both hard- and soft-switched circuits
  • Easy to drive with commonly-used gate drivers
  • GSD pin layout improves the high-speed design
  • 3-lead TO-220 package
  • Halogen-free and RoHS compliant

Applications

  • Datacom
  • Broad industrial
  • PV inverters
  • Servo motors
  • Computing
  • Consumer

Specifications

  • 650V maximum drain-to-source voltage
  • 800V maximum transient drain-to-source voltage
  • ±20V maximum gate-to-source voltage
  • 3.2V to 4.7V gate threshold voltage range
  • 72mΩ to 148mΩ typical drain-source on-resistance range
  • 1.2µA to 8µA typical drain-to-source leakage current range
  • ±100nA gate-to-source leakage current
  • Typical capacitance
    • 638pF input
    • 72pF output
    • 2pF reverse transfer
  • 9nC typical total gate charge
  • 3.7nC typical gate-source charge
  • 2.4nC gate-drain charge
  • 80nC output charge
  • 18A maximum reverse current
  • 1.7V to 2.4V typical reverse voltage
  • 96W maximum power dissipation at +25°C
  • Maximum continuous drain currents
    • 29A at +25°C
    • 18.4A at +100°C
  • 120A maximum pulsed drain current
  • 43.4ns typical turn-on delay
  • 6.2ns typical rise time
  • 56ns typical turn-off delay
  • 7.2ns typical fall time
  • 80ns typical reverse recovery time
  • -55°C to +150°C operating temperature range
  • +260°C maximum soldering peak temperature
  • Thermal resistance
    • 1°C/W junction-to-case
    • 62°C/W junction-to-ambient

Transphorm TP65H070G4PS 650V SuperGaN® GaN FET