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http://www.ti.com/general/docs/suppproductinfo.tsp?distId=26&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fpdf%2Fsbou295″>View Datasheet
Texas Instruments OPA2391DSBGAEVM Evaluation Module permits users to plug the OPA2391YBJ into an existing socketed PDIP test platform to demonstrate the OPA2391. Additionally, the enable pin is carried out to a test point on the top layer to utilize the OPA2391 enable function.
The TI OPA2391DSBGAEVM evaluation module transforms the compact dual DSBGA package into an easy-to-use, standard, dual, 300-mil-wide, PDIP operational amplifier footprint. The enable (EN) pin, which is not found on a common PDIP package, is wired to a separate test point and authorizes evaluation of the enable function. The PCB can be used in a standard, dual-amplifier PDIP socket or as individual connections to each bump on the OPA2391YBJ.
