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Texas Instruments LP-EM-CC1312PSIP LaunchPad™ Development Kit

Texas Instruments LP-EM-CC1312PSIP LaunchPad™ Development Kit is for the CC1312PSIP RF System-in-Package (SIP) module. The RF module has an integrated power amplifier for Sub-1GHz operation up to +20dBm. Protocols supported include mioty, Wi-SUN®, TI 15.4 stack, and Sub-1GHz proprietary RF protocols available in SimpleLink™ Low Power F2 SDK. The Texas Instruments LP-EM-CC1312PSIP is a split LaunchPad development kit that does not contain an XDS debugger. Recommended debuggers are LP-XDS110 or LP-XDS110ET.

Features

  • LaunchPad development kit with Sub-1GHz radio for wireless applications with integrated PCB trace antenna
  • The developer needs to buy a debugger separately for software development and RF evaluation (LP-XDS110 or LP-XDS110ET)
  • Rapid prototyping showcasing a small precertified RF SIP module saves certification and test time
  • This development kit is compatible with the TI BoosterPack Ecosystem and many more hardware components to expand on features to fit the user’s design

Overview

Chart - Texas Instruments LP-EM-CC1312PSIP LaunchPad™ Development Kit

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Texas Instruments LP-EM-CC1312PSIP LaunchPad™ Development Kit