http://www.ti.com/general/docs/suppproductinfo.tsp?distId=26&gotoUrl=https%3A%2F%2Fwww.ti.com%2Flit%2Fgpn%2Fam2732″>View Datasheet

Texas Instruments AM273x/AM273x-Q1 Arm™-Based Microcontrollers

Texas Instruments AM273x/AM273x-Q1 Atm™-Based Microcontrollers are a highly-integrated, high-performance microcontroller based on the Arm® Cortex®-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built-in, large, integrated RAM on a die, and a wide temperature range, the AM273x/AM273x-Q1 offers a safe, secure, and cost-effective solution for many industrial and automotive applications. The Texas Instruments AM273x/AM273x-Q1 device is provided as part of a complete platform solution, including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation. The AM273x-Q1 devices are AEC-Q100 qualified for automotive applications.

Features

Processor cores
- Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly integrated for real-time processing
  - Dual-core Arm Cortex-R5F cluster supports dual-core and single-core operation
  - 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
  - Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
  - Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
- TMS320C66x DSP core
  - Single-core, 32-bit, floating-point DSP
  - Operating at 450MHz (14.4 GMAC)
Memory subsystem
- Up to 5.0MB on-chip RAM (OCSRAM)
  - Memory space sharable between DSP, MCU, and shared L3
  - 3.5625MB shared L3 memory
  - 960KB dedicated to the main subsystem
  - 384KB dedicated to DSP subsystem
- External Memory Interfaces (EMIF)
  - QSPI interface operating up to 67MHz
System on Chip (SoC) services and architecture
- 12x EDMA for various subsystems, MCU, DSP, and accelerator cores
- 5x Real-Time Interrupt (RTI) modules
- Mailbox system for Interprocessor Communication (IPC)
- JTAG/trace interfaces for device debugging
- Clock source
  - 40.0MHz crystal with internal oscillator
  - Supports external oscillator at 40/50MHz
  - Supports externally driven clock (square/sine) at 40/50MHz
High-speed serial interfaces
- 10/100Mbps Ethernet (RGMII/RMII/MII)
- Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
- Output: 4-lane Aurora/LVDS
General connectivity peripherals
- General Purpose Analog to Digital Converters (GPADC)
  - 1x 9-channel ADC supporting up to 625Ksps
- Digital connectivity
  - 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
  - 3x Inter-Integrated Circuit (I²C) ports
  - 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces
- 3x Enhanced Pulse-Width Modulator (ePWM)
- 1x Enhanced Capture Module (eCAP)
- 2x Modular Controller Area Network (MCAN) modules with CAN-FD support
Power management
- Simplified power sequencing and reduced number of power supply rails
- Dual voltage digital I/O supporting 3.3V and 1.8V operation
Security
- Device Security
  - Programmable embedded Hardware Security Module (HSM)
  - Secure authenticated and encrypted boot support
  - Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
  - Crypto hardware accelerators – PKA with ECC, AES (up to 256 bit), TRNG/DRBG
Functional safety
- Functional safety-compliant targeted
  - Developed for functional safety applications
  - Documentation will be available to aid ISO 26262 functional safety system design
  - Hardware integrity up to ASIL B targeted
  - Safety-related certification
    - ISO 26262 certification by TÜV SÜD planned
- AEC-Q100 qualification targeted
- Operating Conditions
  - Automotive-grade temperature range supported
  - Industrial grade temperature range supported
Package options
- ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
- 45nm technology
- Compact solution size

Applications

Robotics
Factory automation safety guards
Building automation
Automotive audio

Traffic monitoring
Machine vision
Avionics
Industrial transport

Texas Instruments AM273x/AM273x-Q1 Arm™-Based Microcontrollers

Features

Applications

Functional Block Diagram

husseinkey ELECTRONICS®

COMPANY