TE Connectivity SolderSleeve Devices for Space Applications

TE Connectivity SolderSleeve Devices for Space Applications provide low outgassing and resistance to extreme temperatures to support critical space industry requirements. The transparent blue SolderSleeve components offer reduced size, weight, and power (SWaP), environmentally protected shield terminations on cables, insulation, protection, and strain relief. Flux-free solder leaves no trace particles post-installation, and the sealing rings ensure the installation remains intact. These features address the need for zero foreign object damage (FOD) levels in demanding space industry solutions. TE Connectivity SolderSleeve Devices can be used for silver-plated cables with a +150°C jacket rating and installed with standard TE tools.

Features

Heat shrinkable technology for one-step shield results in easy inspection
Transparent insulation sleeve saves time during installation
Provides strain relief with ratings of up to +150°C

Minimal tools required to achieve connection, insulation, and protection
Inhouse design and quality controlled process offers reliability and traceability

Applications

Aerospace
- Small, nano, and cube satellites for LEO constellations
- Launch pads

Defense
Marine

Specifications

Materials
- Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride insulation sleeve
- Thermoplastic barrier ring
- Type Sn63 solder without flux per ANSI-J-STD-006
<4.0mV electrical drop

Mechanical
- 15lbs tensile strength
- 15g vibration
Provide shield protection on cables featuring:
- +150°C jacket rating
- Silver shield plating
- Polyimide jacket material, insulated

TE Connectivity SolderSleeve Devices for Space Applications

Features

Applications

Specifications

Dimensions

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