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TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilize a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and are available in various positions and stack heights.
The connectors are available in 60, 114, and 320 positions in 6-row configurations with stack height options of 10mm, 12mm, 17mm, and 18mm. These High-Speed Low-Force XMC Connectors also feature a wide -55°C to +125°C operating temperature range, excellent thermal stability, and data rates to +32Gb/s with VITA 42.3 pinout.
