TE Connectivity / Linx Technologies microSplatch® uSP410 Chip Antennas

TE Connectivity / Linx Technologies microSplatch® uSP410 Chip Antennas are surface-mount monopole chip antennas that target ISM, LoRaWAN®, Sigfox®, and other low-power, wide-area (LPWA) and remote control applications. The uSP410 design uses a grounded-line technique to achieve outstanding performance when subject to nearby sources of interference. TE Connectivity / Linx Technologies microSplatch uSP410 Chip Antennas are available in tape-and-reel packaging and are designed for reflow-solder mounting directly to a printed circuit board for high-volume applications. Evaluation boards with a pre-mounted antenna and SMA connector are also available.

Features

Compact package measures 13.2mm x 9.1mm x 2.9mm
Excellent performance with small ground plane (84mm x 38mm)
Resistant to proximity effect from nearby interferers

Direct surface-mount PCB attachment
Reflow- or hand-solder assembly
Available in tape-and-reel packaging

Applications

ISM
LPWA
LoRaWAN
Sigfox
Wi-Fi HaLow™

Remote controls
Smart home networking
Sensing and remote monitoring
Internet of Things (IoT) devices

Specifications

Common
- -40°C to +130°C operating temperature range
- 5W max. power
- 50Ω impedance
Performance at 430MHz to 435MHz
- 5% efficiency
- -8dBi peak gain
- ≤1.5 VSWR

Performance at 862MHz to 876MHz
- 20% efficiency
- 0.7dBi peak gain
- ≤2.1 VSWR
Performance at 902MHz to 930MHz
- 27% efficiency
- 0.9dBi peak gain
- ≤2.9 VSWR

TE Connectivity / Linx Technologies microSplatch® uSP410 Chip Antennas

Features

Applications

Specifications

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