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TE Connectivity HDC HMN EMC Module Inserts

TE Connectivity’s (TE) HDC HMN EMC Module Inserts are designed to provide EMC protection solutions in modular systems. The HDC HMN EMC Module Inserts allow designers to combine signal and power in one modular system. This solution saves space, increases cost-effectiveness, and avoids additional power noise.

Features

  • EMC shielding
  • Large position (32P) per module
  • Small quantity components design
  • Reliable HDC dynamic contact

Applications

  • Semiconductor manufacturing
  • Machinery
  • Robotics
  • Wind power
  • Warehouse automation

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TE Connectivity HDC HMN EMC Module Inserts