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TDK Ultra-Low-Profile FS1412 µPOL™ DC-DC Power Modules feature a small size of 5.8mm x 4.9mm x 1.6mm and increased performance. The FS1412 series offers ease of use along with simplified integration for applications such as big data, machine learning, artificial intelligence (AI), 5G, telecommunications, and more. The converters operate at a broad junction temperature range of -40°C to +125°C and have a high current density of more than 1000A per cubic inch. TDK Ultra-Low-Profile FS1412 µPOL DC-DC Converters deliver a continuous 12A load capability with a low 1.6mm height, offering a 50% smaller solution size than the other products in its class. This smaller size lowers overall costs and reduces PC board space.
TDK μPOL technology involves a DC-DC converter placed in the vicinity of complex chipsets, including FPGAs, ASICs, and more. By decreasing the distance between the chipset and the converter, the resistance and the inductance components are minimized, enabling a fast response as well as accurate regulation with dynamic load currents.
TDK has been developing this technology for several years to enable system-level solutions that enhance electrical and thermal performance. These high-density, cost-effective solutions are ideal for space-constrained applications that require a low-profile power source. The solutions also incorporate high-performance semiconductors in advanced packaging technologies such as a single semiconductor embedded in substrate (SESUB) and advanced electronic components, to achieve system integration in a smaller size and lower profile via 3D integration. This integration allows TDK to deliver higher efficiency and ease of use for a cost-effective system.
