TDK-Micronas HAR® 3900 Stray-Field Robust 3D Position Sensor is a high-resolution position sensor engineered for highly accurate position measurements. This sensor addresses the need for stray-field robust 2D position sensing (linear and angular) and ISO 26262-compliant development. The HAR 3900 provides full redundancy thanks to two independent dies stacked in a single package, each electrically connected to the pins of one package side. This stacked-die architecture makes sure both dies occupy the same magnetic-field position to generate synchronous measurement signals. Programming is accomplished via the SPI interface, and the HAR 3900 measures 360° angular range, linear movements, and 3D position information. Based on Hall technology, the module measures vertical and horizontal magnetic-field components and suppresses external magnetic stray fields using an array of Hall plates.
TDK-Micronas HAR 3900 Stray-Field Robust 3D Position Sensor is ASIL B ready and can be integrated into automotive safety-related systems up to ASIL D. The module comes in a 16-pin SSOP-16 SMD package.