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Renesas / Dialog SLG47115V-DIP Proto Board

Renesas / Dialog SLG47115V-DIP Proto Board is a small PCB that adapts the SLG47115V HVPAK™ (High-Voltage GreenPAK™) Mixed-Signal Matrix TQFN package into a DIP footprint. The SLG47115V-DIP Proto Board can speed design by enabling easy breadboarding and prototyping. 

The Dialog Semiconductor SLG47115V-DIP Proto Board requires GreenPAK DIP Adapter (SLG4SA-DIP) to use with the SLG4DVKADV GreenPAK™ Advanced Development Board.

Features

  • Perfect for breadboarding and fast prototypes
  • Simplifies prototyping of SMT ICs
  • 20-pin DIP footprint with 0.3″ width
  • Four high voltage high current output GPOs
  • Current up to 1A per HV GPO
  • Current sensing resistors
  • Optional VDD LED indicator
  • Decoupling capacitor included
  • Screw terminals for high voltage high and current lines
  • Optional I2C pull-up resistors

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Renesas / Dialog SLG47115V-DIP Proto Board