Renesas / Dialog DA14592 SmartBond™ BLE 5.2 SoC with Embedded FLASH

Renesas/Dialog DA14592 SmartBond™ Multi-Core Bluetooth® Low-Energy (BLE) 5.2 System-on-Chip (SoC) with Embedded FLASH features CM33F @64MHz as application core and CM0+@64MHz as configurable MAC. This multi-core BLE SoC also features a quad-decoder (active in hibernation) and 8-channel sigma-delta ADC with 15 Effective Number of Bits (ENOB). The DA14592 SoC offers high-precision analog measurements and M33 + M0 ARM Cortex cores that support floating point application programming. This SoC allows the expansion of memory with QSPI external FLASH/RAM. Typical applications include asset tracking, data logger, human interface device, activity tracker, high-end voice RCU, and crowd-sourced locations.

The DA14592 offers low overall radio power consumption and a low-power mode with a radio transmit current of only 2.3mA at 0dBm and a radio receive current of 1.2mA. Furthermore, it supports an ultra-low hibernation current of 90nA, which extends the shelf-life of end-products shipped with a connected battery. For products that require extensive application processing, it also boasts an ultra-low active current of 34µA/MHz.

The Renesas DA14592 SoC typically requires only 6 external components, delivering best-in-class eBOM and offering a low solution cost and size. Its high accuracy on-chip RCX removes the need for an external, sleep mode crystal with most applications only requiring a 32MHz crystal. Package options include WLCSP (3.32mm x 2.48mm) and FCQFN (5.1mm x 4.3mm) offering an attractively small solution footprint.

Features

  • Multi-core:
    • CM33F @64MHz as application core
    • CM0+@64MHz as configurable MAC
  • 96kB RAM (16kB Cache), 256kB FLASH, 288kB ROM, and QSPI external FLASH/RAM expansion
  • 8-channel sigma-delta ADC with 15 ENOB
  • Power consumption:
    • Receiver = 2.6mA
    • Transmitter = 3.5mA
    • Active = 34μA/MHz
    • Hibernation = 75nA
  • Quad-decoder (active in hibernation)
  • M33 dedicated to apps, M0+ for BLE
  • High-precision analog measurements
  • OTP key storage and secure boot
  • Requires six external components
  • Available in WLCSP (3.32mm x 2.48mm) or FCQFN (5.1mm x 4.3mm) package

Applications

  • Crowd-sourced locations:
    • Google FMD
    • Apple FindMy (reference designs)
  • Asset tracking
  • Connected health
  • Human interface device
  • Activity tracker
  • Data logger
  • PoS reader
  • Metering
  • High-end voice RCU
  • IoT end node

Videos

Block Diagram - Renesas / Dialog DA14592 SmartBond™ BLE 5.2 SoC with Embedded FLASH

Renesas / Dialog DA14592 SmartBond™ BLE 5.2 SoC with Embedded FLASH