Ohmite VR Heat Sinks offer a low profile, large surface area, and are configurable using a universal cam clip system. These heat sinks are designed to accommodate TO-220, TO-247, and high-power IXYS packages. The VR heat sinks feature a through-hole mounting style onto PCBs and are ideal for compact (1U or 2U) packaging with forced convection cooling. These VR heat sinks are available in 27mm and 55mm versions and are ideally used with high-wattage IXYS devices, TO devices, and the CS10 products.