NXP Semiconductors A5M36TG140TC-EVB Top-Side Cooling Evaluation Board

NXP Semiconductors A5M36TG140TC-EVB Top-Side Cooling Evaluation Board allows for thinner 5G massive MIMO radios. The NXP Semiconductors A5M36TG140TC-EVB removes the need for the dedicated RF shield and separates thermal management from RF design. The first family of NXP top-side cooled devices are designed for 64T64R (320 W) or 32T32R (200 W) mMIMO radios covering 3.3GHz to 3.8GHz.

Features

Reduces radio thickness and weight
Enables fewer and shorter connectors
Removes the need for top-side RF shielding

Cleaner separation of thermal and RF paths
Lower thermal resistance

Applications

Communication Infrastructure
5G massive MIMO radio units (typically 64T64R 320W or 32T32R 200W)

Drivers for high-power macro base stations
Open RAN and proprietary radio access networks
Outdoor small cells

Related Boards

A5M35TG140TC-EVB Evaluation Board

A5M34TG140TC-EVB Evaluation Board

husseinkey ELECTRONICS®

COMPANY