Nexperia GAN039 CCPAK1212-Packaged Power GaN FETs

Nexperia GAN039 CCPAK1212-Packaged Power GaN FETs offer copper-clip package technology with low inductances, low switching losses, and high reliability. Wire-bond-free for optimized thermal and electrical performance, these devices provide a cascode configuration to eliminate the need for complicated drivers and controls. The surface-mount GAN039 FETs have top-side (CCPAK1212i) or traditional bottom-side (CCPAK1212) cooling to improve heat dissipation, providing added design flexibility. The CCPAK1212 and CCPAK1212i package styles feature a compact footprint of 12mm x 12mm with a low 2.5mm package height. Flexible gull-wing leads provide robust board-level reliability for extreme temperature environments.