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Murata LDB Chip Multilayer Hybrid Baluns

Murata LDB Chip Multilayer Hybrid Baluns are constructed with a copper conductor and ceramic material, making them ideal for high-frequency applications. These chip-type baluns offer low loss and 100Ω impedance at balanced terminals. They are SMD and come in a small package with a low profile. Murata LDB Chip Multilayer Hybrid Baluns are available in tape-and-reel packing for automatic mounting.

Features

  • Constructed with a copper conductor and ceramic material
  • Ideal for high-frequency applications
  • 100Ω impedance at balanced terminals
  • Small SMD size with a low profile
  • Low loss
  • Available in tape-and-reel packing for automatic mounting

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Murata LDB Chip Multilayer Hybrid Baluns