MultiTech MultiConnect® mDot™ LoRa® Modules

MultiTech MultiConnect® mDot™ LoRa® Modules are designed to provide long-range, low-bit-rate M2M data connectivity to sensors, industrial equipment, and remote appliances. For ease of use, the low-power mDot Modules are pre-certified and Arm® Mbed™ programmable. The Modules are LoRaWAN® 1.0.2 compliant, providing bi-directional data communication up to 15km (10 miles) line-of-sight and 2km (1 to 3 miles) in buildings, using sub-GHz ISM bands in North America, Europe, Australia, and Asia Pacific (AS923). The mDot Modules bring security, intelligence, reduced complexity, and a low overall bill of material cost to the very edge of the network while supporting a variety of electronic interfaces to connect just about any device for years on battery power.

The MultiTech MultiConnect mDot Modules are available for a wide variety of regions (North America, Europe, Australia/New Zealand, Asia/Pacific, and Japan) and with several antenna input options (SMA, u.FL, RF pad).

Features

  • LoRaWAN 1.0.2 compliant
  • FCC/CE/RCM/GITEKI certified for use in North America, Europe, Australia, and Japan
  • Developer friendly Arm Mbed libraries provide customization capability for specific applications
  • Onboard Flash and RAM reduce overall costs
  • Unicast and Multicast message support
  • Multiple I/O interfaces
  • Data rates 293bps 20Kbps+ LoRa

Applications

  • Mesh network replacement
  • Managing and harvesting sensor data
  • Controlling and monitoring remote assets and devices

Application Example

MultiTech MultiConnect® mDot™ LoRa® Modules

Specifications

  • CPU: STMicroelectronics STM32F411RET
  • Max Clock: 100MHz (configurable to power use)
  • Memory
    • 512KB Flash (400KB customer usable)
    • 128KB RAM
  • Radio frequency
    • 860MHz to 1020MHz
    • FSK, GFSK, MSK, GMSK, OOK, LoRa Digital Spread Spectrum
  • Regions
    • MTDOT-868: Europe
    • MTDOT-915: North America and Australia
    • MTDOT-923: Asia and Pacific
  • Communication
    • LoRaWAN 1.0.2 compliant, Class A and Class C
    • Arm Mbed libraries or AT commands for radio control
  • Interfaces 
    • Up to 21 Digital I/O
    • Up to 11 Analog Inputs
    • SPI, I2C, UART (RX, TX, RTS, CTS)
    • Pin functions are multiplexed
  • Maximum transmitter power output
    • MTDOT-868: 14dBm
    • MTDOT-915: 19dBm
    • MTDOT-923: Varies by country
  • Maximum receive sensitivity
    • MTDOT-868: -137dBm
    • MTDOT-915: -130dBm
    • MTDOT-923: Varies by country
  • Link budget
    • MTDOT-868: 151dB Point-to-Multipoint, 147dB Point-to-Point
    • MTDOT-915: 145dB Point-to-Multipoint, 147dB Point-to-Point
    • MTDOT-923: Varies by country
  • Maximum effective isotropic radiated power (EiRP)
    • MTDOT-868: 10dBm
    • MTDOT-915: 36dBm
    • MTDOT-923: Varies by country
  • Input voltage 3.3V to 5.0VDC ±5%
  • Operating temperature: -40°C to +85°C (-40°F to +185°F)
  • Storage temperature: -40°C to +85°C (-40°F to +185°F)
  • Relative humidity: 20% to 90% RH non-condensing
  • Physical Dimensions 25.5mm x 37.3mm (1.0″ x 1.47″)
  • EMC Compliance
    • US: FCC Part 15 Class B
    • EU: EN 55022 Class B, EN 55024.
    • Canada: ICES-003
  • Radio Compliance: FCC 15.247, IC RSS-210, EU EN 300 220
  • Safety Compliance: UL/cUL 60950-1 2nd Ed., cUL 60950-1 2nd Ed., IEC 60950-1 2nd Ed., AS/NZS 60950.1
  • Quality
    • MIL-STD-810G: High Temp, Low Temp, Random Vibration
    • SAE J1455: Transit Drop and Handling Drop, Random Vibration, Swept-Sine Vibration
    • IEC68-2-1: Cold Temp.
    • IEC68-2-2: Dry Heat

Resources

  • Datasheet
  • mDot Developer Guide
  • AT Command Reference Guide

Videos

Pin Designations

MultiTech MultiConnect® mDot™ LoRa® Modules

MultiTech MultiConnect® mDot™ LoRa® Modules