Molex Sentrality High-Current Interconnect System

Molex Sentrality High-Current Interconnect System features high-current mezzanine style board-to-board connectors, allowing engineers to overcome tolerance stack-up issues when mating pins and sockets. The system uses a unique design that provides up to 1mm of radial self-alignment, minimizing potential damage to the contact beams during mating. The product is available in four sizes (3.4mm, 6mm, 8mm, and 11mm) with current ratings of 75A to 350A, depending on size. The connectors are offered in a wide range of mating configurations, and board attachment options are available for both PCBs and busbars. Sentrality applications can be found in the industrial automation, data center, electric vehicle, and telecommunications markets.

Features

  • Capable of transmitting 75A to 350A current rating
  • Low contact resistance and low voltage drop minimize heat generation at the contact interface
  • Self-aligning sockets float between wave springs
  • Surface-mount, screw-mount, and press-fit board attach options for manufacturing flexibility
  • Top-entry and bottom-entry socket assemblies with a positionable flange
  • Easy customization for application-specific needs
  • Compact design useful in applications with space constraints
  • Halogen-free and RoHS compliant

Applications

  • Data centers/central offices
    • Switches
    • Servers
    • Power distribution units (PDUs)
    • Power shelves
  • Telecom
    • 5G/6G radios
    • Cellular repeaters
  • Electric vehicle infrastructure 
    • Level 3 EV charging station (480V) inverters
  • Electric vehicle drivetrains
    • Battery management systems
    • Power distribution units (PDUs)
    • Inverters
    • DC-DC converters
  • Industrial automation
    • Robotics
    • Conveyors
    • Assembly equipment
  • Energy storage
    • Home battery system inverters
      • Solar
      • Electric vehicle
    • Commercial battery system inverters
      • Solar
      • Wind
      • Power grid
  • Supercomputers
    • Power distribution units (PDUs)

Specifications

  • 3.4mm, 6mm, 8mm, and 11mm lengths
  • Electrical
    • 600V maximum
    • 75A to 350A maximum current range
    • 0.20mΩ to 0.40mΩ maximum contact resistance range
  • Mechanical
    • 20N to 55N maximum mating force range
    • 6N to 10N minimum unmating force
    • 10N to 70N maximum OmniGlide alignment force range
    • 200 mating cycle durability
  • Physical
    • Black LCP eye-of-needle socket housing
    • High-performance copper (Cu) alloy contacts
    • Plating
      • Gold (Au) socket contact area
      • Silver (Ag) eye-of-needle socket-compliant tail
      • Silver (Ag) pin
    • 1.58mm minimum PCB thickness
    • 1.50mm minimum busbar thickness
  • -40°C to +125°C operating temperature range

Videos

Molex Sentrality High-Current Interconnect System