LeaderTech TCI Composite Indium Sheet

LeaderTech TCI Composite Indium Sheet is designed to transition from solid to liquid at its melting point and back to solid again at room temperature. This thermal interface product also offers uniform thermal resistance in compressed environments where low stress is applied. Other features include good thermal stability, +80°C melting point, and a thickness range of 0.2mm to 0.5mm. LeaderTech TCI Composite Indium Sheet is ideal for applications such as graphic processors, base stations, microprocessors, laptops, and CPUs / APUs.

Features

  • Low pressure capabilities
  • Low thermal resistance
  • Good thermal stability
  • Composite indium sheet
  • Transitions from solid to liquid at its melting point and back to solid at room temperature

Applications

  • Graphic processors
  • Base stations
  • Microprocessors
  • Laptops, CPUs / APUs

Specifications

  • ≥80W/m-K thermal conductivity Z axis
  • 80W/m-K thermal conductivity X axis, Y axis
  • ≤0.04°C-cm2/W thermal impedance at 50psi
  • 0.2mm to 0.5mm thickness range
  • +80°C melting point
  • -50°C to +500°C operating temperature range
  • Storage conditions
    • Store in dark environment
    • ≤+30°C storage temperature
    • ≤+70% storage humidity
  • 1-year shelf life at storage conditions

Properties Chart

LeaderTech TCI Composite Indium Sheet

Thermal Impedance

LeaderTech TCI Composite Indium Sheet

LeaderTech TCI Composite Indium Sheet