Lantronix Open-Q™ 2290 System in Package (SIP)

Lantronix Open-Q™ 2290 SIP is an entry-tier solution that delivers good performance, impressive graphics, and camera capabilities. This SIP is based on the Qualcomm® QCS2290 System-On-Chip (SoC), with onboard audio codec, 16GB of eMMC, 2GB of LPPDR4 memory, and pre-certified Wi-Fi® and BLUETOOTH®. The Open-Q™ 2290 SIP comes with Android™ 12 Go software and are FCC and RED certified. This SIP comes in 35mm x 35mm x 2.8mm dimensions and operates within an extended temperature range of -25°C to 85°C. Typical applications include POS/kiosks, vending machines, exercise equipment displays, camera applications, and entry-level robotics, including warehouse and logistics.

Features

  • Scalable volume deployment through:
    • Future ConsoleFlow™ support for device management
    • Zero-touch provisioning
    • OTA updates of functionality and security
  • Secure compute platform
  • Delivers impressive graphics, camera capabilities, and power performance
  • Long device life cycle

Specifications

  • QCS2290 chipset
  • 2GB LPDDR4 memory
  • 16GB eMMC storage
  • Display interfaces:
    • One 4-lane; DSI D-PHY 1.2. Split link supported
    • Adreno 702 @ 845MHz
    • OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0
    • HD+ (1680×720) @60fps
  • Camera interfaces:
    • 2-ISP
    • Two cameras:
      • 13MP +13MP @30fps
    • One camera:
      • 25MP @30fps
  • I/O:
    • USB 3.1
    • Type-C
    • SDIO
    • UART
    • SPI
    • I2C
    • I3C
    • GPIO
  • -25°C to 85°C extended operating temperature range
  • 35mm x 35mm x 2.8mm dimensions
  • FCC and RED certifications
  • Android™ 12 Go software

Applications

  • Industrial IoT applications, including handhelds and panels
  • Camera applications
  • POS/kiosk
  • Vending machines
  • Exercise equipment displays
  • Entry-level robotics, including warehouse and logistics

Dimensions

Mechanical Drawing - Lantronix Open-Q™ 2290 System in Package (SIP)

Lantronix Open-Q™ 2290 System in Package (SIP)