Laird Performance Materials Tgon™ 805 Series Thermal Interface Pads

Laird Performance Materials Tgon™ 805 Series Thermal Interface Pads feature a grain-oriented and plate-like structure that provides a high thermal conductivity. These interface pads include high thermal conductivity of 5W/mK on the Z-axis and 240W/mK in the X-Y axis. The Tgon 805 series are available with proprietary pressure-sensitive adhesive on one side that minimizes impact on thermal performance. These interface pads offer >98% graphite, low thermal resistance, and high performance. The Tgon 805 series is ideal for use in power conversion equipment, power supplies, large telecommunications switching hardware, and notebook computers.