Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler

Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020″ to 0.200″. Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.

Features

Ceramic-filled silicon sheets
Low pressure versus deflection
Excellent surface wetting for low contact resistance
Minimizes board and component stress
Low outgassing

Large tolerance applications
Environmentally friendly solution that meets regulatory requirements
RoHS and REACH compliant

Applications

Automotive
Consumer

Industrial
Telecommunications

Specifications

7.5W/mK thermal conductivity
3.5g/cc density
Low D3-D20 (<20ppm)

0.020″ to 0.20″ thickness range
-50°C to +125°C temperature range

Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler

Features

Applications

Specifications

husseinkey ELECTRONICS®

COMPANY