Laird Performance Materials Tflex™ HD7.5 Thermal Gap Filler

Laird Performance Materials Tflex™ HD7.5 Thermal Gap Filler is a soft silicone material that offers high deflection and 7.5W/mK thermal conductivity. The HD7.5 series is designed to provide superior pressure vs. deflection characteristics. The material offers minimal stress on components during application while maintaining low thermal resistance. Additional features include low outgassing and oil bleeding, 3.4g/cc density, and -40°C to +150°C temperature range. Laird Performance Materials Tflex HD7.5 Thermal Gap Filler is available in 18″ x 18″ and 9″ x 9″ standard sheet sizes with thicknesses ranging from 1mm to 5mm in 0.25mm increments.

Features

  • Ceramic-filled silicone sheets
  • Low pressure vs. deflection
  • Minimizes board and component stress
  • Low outgassing and oil bleeding
  • Elastomeric thermal gap filler product
  • Large tolerance applications

Applications

  • Telecom
  • Datacom
  • Consumer electronics
  • Industrial

Specifications

  • 7.5W/mK thermal conductivity
  • 3.4g/cc density
  • -40°C to +150°C temperature range
  • 1mm (0.40″) to 5mm (0.200″) thickness range
  • 0.25mm (0.010″) increments
  • 18″ x 18″ and 9″ x 9″ standard sheet sizes

Videos

Performance Graphs

Laird Performance Materials Tflex™ HD7.5 Thermal Gap Filler

Laird Performance Materials Tflex™ HD7.5 Thermal Gap Filler