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KEMET KC-LINK™ Capacitors with KONNEKT™ Technology are surface-mount capacitors designed for high-efficiency and high-density power applications. KONNEKT high-density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface-mount multichip solution for high-density packaging. By utilizing KEMET’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.
KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance vs. DC voltage and negligible change in capacitance vs. temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.
These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers Effective Series Resistance (ESR) and Effective Series Inductance (ESL), which increases ripple current handling capability.
