iWave Systems FPGA Heat Sinks for SOMs

iWave Systems FPGA Heat Sinks for SOMs are designed for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC. The FPGA Heat Sinks are available in a 95mm x 75mm package made up of aluminium material. The devices have a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The rugged and light weight heat sinks can be easily attached with the iWave’s FPGA system on modules.

Features

  • 95mm x 75mm Package
  • Aluminium material
  • Silicone elastomer as a thermal gap pad
  • Rugged and light weight

Applications

  • Arria10 FPGA SOM
  • Zynq Ultrascale+ MPSOC FPGA SOM

Zynq Ultrascale+ Package

iWave Systems FPGA Heat Sinks for SOMs

Arria10 Package

iWave Systems FPGA Heat Sinks for SOMs

iWave Systems FPGA Heat Sinks for SOMs