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Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Infineon Technologies REF_SiC_D2Pak_MC and REF_SiC_D2Pak_BP Reference Boards allow users to evaluate the 1200V CoolSiC™ MOSFET in D2Pak with coreless isolated gate drivers. The REF_SiC_D2Pak_MC Board utilizes the 1EDC20I12MH with Miller clamp function. The REF_SiC_D2Pak_BP Board utilizes the 1EDI20H12AH with bipolar power supply and separated sink/source output.

The Infineon REF_SiC_D2Pak_MC and REF_SiC_D2Pak_BP Reference Boards are designed as daughter boards to fit the 1200V CoolSiC MOSFET in the TO-247 3-/4-pin evaluation platform. Users can do a double pulse test to evaluate the CoolSiC MOSFET’s performance and coreless isolated gate drivers by installing the reference daughterboard on the evaluation platform.

Features

  • Both daughter boards utilize insulated metal substrate (IMS), which provides an excellent thermal conduction capability
  • All the components are surface mounted devices (SMD) due to the IMS board type
  • Creepage is at least 4mm to ensure the safe operation under 800VDC bus voltage

Block diagram

Block Diagram - Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Component Layout

Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards

Infineon Power and Sensing Selection Guide

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Infineon Technologies REF_SiC_D2Pak_MC & REF_SiC_D2Pak_BP Boards