Infineon Technologies IM69D127 XENSIV™ MEMS Microphone

Infineon Technologies IM69D127 XENSIV™ MEMS Microphone is based on Infineon’s sealed dual membrane MEMS technology, providing high ingress protection (IP57) at a microphone level. The high-performance MEMS microphone is available in a small 3.6mm x 2.5mm package, ideal for compact audio devices like TWS earbuds.

Features

Very-low self-noise / very-high SNR (69dB)
Selectable power modes for battery critical applications
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
Very-low group delay (9µs)

Small package size (3.6mm x 2.5mm x 1mm)
Very tight part-to-part phase and sensitivity matching (±1dB)
Flat frequency response with a low LFRO (low-frequency roll-off) of 40Hz

Applications

TWS Earbuds
ANC Headphones

Laptops and tablets
Wearables

Block Diagram

Block Diagram - Infineon Technologies IM69D127 XENSIV™ MEMS Microphone

Infineon Power and Sensing Selection Guide

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