Infineon Technologies Flash+RAM MCP Solutions

Infineon Technologies Flash+RAM MCP Solutions are for systems that require flash and RAM, implementing Infineon’s multi-chip package (MCP) solutions to simplify overall system design. MCP products integrate both memories into a single package, decreasing the BOM, lowering the pin count, and reducing PCB size and layer requirements. The Flash+RAM MCP Solutions supply performance and quality into one space-saving package.

The Infineon Flash+RAM MCP Solutions Gen 2 improves on HYPERBUS™ MCP (the prior generation) with increased performance and reliability. The MCP Gen 2 upgrades from HYPERFLASH™ to SEMPER™ NOR Flash and from HYPERRAM™ 1.0 to HYPERRAM™ 2.0. MCP Gen 2 also extends chipset support by adding an Octal interface option.

Features

  • Density configuration of 512Mb Flash + 64Mb RAM
  • Interface:
    • Octal (xSPI Profile 1)
    • HYPERBUS™ (xSPI Profile 2)
  • Performance of 400MB/s read bandwidth
  • 1.8V or 3.0V voltages
  • -40°C to +105°C Automotive Grade 2 temperature range
  • 24-ball BGA (8mm x 8mm) package

Applications

  • Dashboard
  • Infotainment
  • HMI
Infineon Technologies Flash+RAM MCP Solutions

Infineon Technologies Flash+RAM MCP Solutions