EPCOS / TDK Ultrasonic Sensor Modules

TDK Ultrasonic Sensor Modules come in a robust package that is mechanically decoupled from the sensor element. These ultrasonic Time-of-Flight (ToF) range sensors feature a high-end application-specific integrated circuit (ASIC) chip. The versatile modules detect objects using inaudible ultrasonic waves, which are transmitted and received by a piezoelectric disc. This user-friendly, all-in-one package includes the driver and measures distances completely invisible and contact-free. The front side of the modules also resists dust and water. TDK Ultrasonic Sensor Modules offer a measurement range of up to 200cm, making them ideal for applications such as obstacle and collision avoidance, and distance measurement in stationary systems.

Features

  • Sensor modules with integrated ASIC for measurements in air
  • Robust package mechanically decoupled from the sensor element
  • Measurement range of up to 200cm
  • Sample rate up to 50 samples/s
  • Individual measuring scenarios programmable
  • Front side protected from dust and water splashes

Applications

  • Systems for obstacle detection and collision avoidance in mobile systems, including automated guided vehicles (AGVs) and automated mobile robots (AMRs)
  • Distance measurement in stationary systems (such as level measurement)

Specifications

  • B59110W2111W032
    • 22mm diameter
    • 10.5mm thickness
    • 74.5kHz serial resonance frequency
  • B59150X0754P030
    • 15mm diameter
    • 13mm thickness
    • 73.5kHz serial resonance frequency

Sensor Operation

EPCOS / TDK Ultrasonic Sensor Modules

Videos

EPCOS / TDK Ultrasonic Sensor Modules