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Chip Quik Solderability Testing Flux for Tin/Lead Solder

Chip Quik Solderability Testing Flux for Tin/Lead Solder is an isopropyl alcohol-based no-clean liquid flux that does not require post-use cleaning. This liquid flux meets IPC J-STD-002 for flux #1 and #2. The solderability testing flux liquid comes in a 15ml squeeze bottle with a shelf life of >24 months with or without refrigeration.

Features

  • RMA liquid flux
  • Isopropyl alcohol-based
  • Solderability testing flux for Lead-free solder
  • IPC J-STD-002 and flux #1 & #2
  • RoHS 3 and REACH compliant

Specifications

  • 0.8 specific gravity
  • 15ml squeeze video
  • >24 months shelf life
  • 20°C to 25°C operating temperature range

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Chip Quik Solderability Testing Flux for Tin/Lead Solder