Chip Quik Solder Wire

Chip Quik is now offering an expanded solder wire portfolio, including WW100Ge.020, SMD-SC-CQ100Ge-0.031, and SMD-SC-SN96AG4-0.031 wire series. The SMD-SC-CQ100Ge-0.031 and SMD-SC-SN96AG4-0.031 are 0.8mm solid solder wires without flux cores, available in 1oz packages. The SMD-SC-CQ100Ge-0.031 solder wire is constructed with tin, copper, nickel, and germanium and features a melting point of +227°C. The SMD-SC-SN96AG4-0.031 solder wire is constructed of tin and silver and offers a melting point of +221°C. The WW100Ge.020 is a 0.5mm solder wire made of tin, copper, nickel, and germanium with a No-Clean Water-Washable synthetic flux core. The WW100Ge wire is offered in a 1lb spool. All the Chip Quik soldering wires introduced are RoHS 3 and REACH compliant with a uniform grain structure.

Features

  • Uniform grain structure
  • Produces bright, shiny joints with no shrinkage
  • Germanium alloy acts as an antioxidant
  • Reduces dross when used in solder pots and wave soldering machines
  • No-Clean Water-Washable synthetic flux core (WW100Ge.020)
  • Halogen-free
  • Lead-free
  • RoHS 3 and REACH compliant

Specifications

  • WW100Ge.020
    • Sn99.244/Cu0.7/Ni0.05/Ge0.006 alloy (tin, copper, nickel, and germanium)
    • 0.5mm wire diameter
    • REL0 flux classification
    • +227°C melting point
    • 1lb spool
    • >60-month shelf life
  • SMD-SC-SN96AG4-0.031
    • Sn96/Ag4 alloy (tin and silver)
    • 0.8mm wire diameter
    • No flux core, solid solder wire
    • +221°C melting point
    • 1oz spool
    • >60-month shelf life
  • SMD-SC-CQ100Ge-0.031
    • Sn99.244/Cu0.7/Ni0.05/Ge0.006 alloy (tin, copper, nickel, and germanium)
    • 0.8mm wire diameter
    • No flux core, solid solder wire
    • +227°C melting point
    • 1oz spool
    • >60-month shelf life

Chip Quik Solder Wire