Bergquist Company TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler

Bergquist TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler is a two-part, silicone-free liquid TIM gap filler that provides thermal conductivity of 3.0W/m-K. The filler also offers a fast dispense rate conducive to mass production environments and high dielectric strength for outstanding electrical performance. Bergquist TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler offers high-reliability performance, no concerns of silicone contamination, and low stress on sensitive components. This material can be used in multiple applications, including industrial automation/power conversion, automotive electronics, and computers/peripherals.

Features

3.0W/m-K thermal conductivity
Dispensable liquid, 2K silicone-free gap filler
Room temperature cure, no oven required
High thermal performance up to +100°C
Extremely high dispense rate, equipment dependent
Low compression stress during assembly

High reliability
No outgassing interference
High throughput
1:1 mixing ratio
UL 94V-0 rated
Halogen free and RoHS compliant

Applications

Power/industrial automation
- Power inverters
- SMD power switching
- EV chargers
Automotive
- Audio amplification
- Infotainment systems
- Power conversion

Electronics
- Memory
- SOC
- High thermal ICs dissipation required

Specifications

74 hardness (shore 00)
>10kV/mm dielectric strength
-40°C to +100°C application temperature range
Room temperature storage
Full cure in 3 hours at +85°C

6-month shelf life
1.5cc/second dispense rate
>12-hour working time
3.0g/cc density
10⁰⁸Ω-m volume resistivity

Bergquist Company TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler

Features

Applications

Specifications

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