Amphenol FCI Flexible Printed Circuit Assemblies

Amphenol FCI Flexible Printed Circuit (FPC) Assemblies are board-to-board solutions that offer a flexible option for space-constrained environments where PCBs are not an option. These assemblies have a comprehensive range of pitch sizes, positions, and stack heights, ensuring all needs are satisfied. FPC assemblies feature high-speed performance up to 16Gb/s and utilize SMT processes with higher process consistency. Amphenol FCI FPC Assemblies are suitable for various applications, including automotive, communication, consumer, medical, and industrial.

Features

Flexible option for space-constrained environments where PCBs are not an option
High-speed performance up to 16Gb/s

Comprehensive range of pitch sizes, positions, and stack heights to satisfy all needs
Utilizes SMT process with higher process consistency

Applications

Automotive
Communications
Consumer

IT/DA
Industrial and instrumentation
Medical

Specifications

0.3A to 20A current rating per contact
1000MΩ minimum insulation resistance
20mΩ maximum LLCR
Copper alloy terminal

UL 94V-0 thermoplastic LCP housing
30 to 200 cycles of durability
MIL-STD-202, method 201 or USCAR2 V2 vibration
-55°C to +125°C operating temperature range

Amphenol FCI Flexible Printed Circuit Assemblies

Features

Applications

Specifications

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