Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module

Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module features a trench/fieldstop IGBT4 and four emitter-controlled diodes with PressFIT/NTC/TIM. The FS75R17W2E4P_B11 offers low switching losses and a low V_CE,sat. The device implements PressFIT contact technology and a rugged mounting design via integrated mounting clamps.

Features

Electrical features
- V_CES = 1700V
- I_C nom = 75A / I_CRM = 150A
- Low switching losses
- Low V_CE,sat

Mechanical features
- Al₂O₃ substrate with low thermal resistance
- PressFIT contact technology
- Rugged mounting due to integrated mounting clamps
- Compact design
- Pre-applied thermal interface material

Applications

UPS systems
Air conditioning
Motor drives
Servo drives

Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068

Circuit diagram

Application Circuit Diagram - Infineon Technologies FS75R17W2E4P_B11 EasyPACK™ Module

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