TE Connectivity AMPMODU 1.0mm Centerline Interconnect System

TE Connectivity’s (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

Features

85% space savings on PCB with 1.0mm centerline as compared to the 2.54mm (0.100″) connectors
Reliable signal transfers through two points of contact even in severe shock/vibration applications
Manufacturing flexibility in an automated environment with surface mount configuration with pick and place cap

Improved durability and corrosion resistance with gold plating
Time savings thanks to reflow capable materials
Greater flexibility in the assembly of boards with dual entry receptacles
RoHS and REACH compliant

Applications

Industrial controls
Building and home automation devices
Servo drives
Programmable logic controllers (PLC)

I/O devices
Telecommunication equipment
Robotics
Instrumentation and test equipment

Specifications

1.0mm (0.0394″) centerline
SMT
Vertical mounting angle
Dual-beam receptacle contact design
Dual-entry receptacle
Double row, 5 to 50 positions per row
Electrical
- 1A maximum current per contact
- 30V_AC operating voltage
- 300VAC dielectric withstanding voltage

Mechanical
- -55°C to +125°C operating temperature range
- Re-flow solder-capable up to +260°C
Materials
- High-temperature LCP thermoplastic housing
- Copper alloy contacts
- Plating options
  - 30µ” (0.76µm) gold
  - 5µ” (0.1µm) gold flash

TE Connectivity AMPMODU 1.0mm Centerline Interconnect System

Features

Applications

Specifications

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