Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel

Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel is designed to meet the performance needs of next-generation 5G base stations and remote antenna systems. The pre-cured, one-part gel has a thermal conductivity of 6.0W/m-K and can be used in gaps as large as 3mm. The gel offers high thermal conductivity, good dispensing efficiency, and high thermal reliability. This material is specially designed to provide an effective electronic component cooling capability for 5G base stations and remote antenna assemblies where a highly reliable vertical gap stability is required. Bergquist Liqui-Form TLF 6000HG Liquid Formable Gel is pre-cured, requiring no mixing or refrigeration.

Features

6.0W/m-K thermal conductivity
Dispensable pre-cured gel
Stable viscosity in storage and in the application

Excellent chemical and mechanical stability
For gaps as large as 3.0mm
Automated dispensing capable

Applications

Telecom wireless infrastructure
- Remote radio unit (RRU)
- Active antenna unit (AAU)
- Baseband processing unit (BPU)

Filling gaps between heat-generating devices to heat sinks
Devices requiring low assembly pressure
High-value assemblies with rework

Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel

Features

Applications

Thermal Gel

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