Laird Performance Materials Tflex™ SF800 Thermal Gap Filler

Laird Performance Materials Tflex™ SF800 Thermal Gap Filler is a high-performance, silicone-free, thermally conductive gap pad. This series combines high thermal conductivity with exceptional wetting characteristics to provide low thermal resistance. Laird Performance Materials Tflex SF800 Thermal Gap Filler is RoHS and REACH compliant. The SF800 series is ideally used in applications where silicone-based pads are traditionally used and in those applications that are silicone sensitive.

Features

  • Silicone-free gap filler
  • 7.8W/mK thermal conductivity
  • 3.21g/cc density
  • -25°C to +120°C operating temperature range
  • Low thermal resistance
  • Standard thickness
    • 0.5mm to 4mm thick material
    • 0.25mm increments
    • Standard sheet sizes of 9″ x 9″
  • RoHS and REACH compliant

Applications

  • Automotive
  • Silicone-sensitive
  • Optical components
  • Medical devices
  • Aerospace electronics

Performance Graphs

Laird Performance Materials Tflex™ SF800 Thermal Gap Filler

Laird Performance Materials Tflex™ SF800 Thermal Gap Filler