Bergquist Company TGP 3000ULM 3W/m-K Extremely Soft GAP PAD®

Bergquist Company TGP 3000ULM 3W/m-K Extremely Soft GAP PAD^® is a soft gap-filling material rated at a thermal conductivity of 3W/m-K. The pad is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. Bergquist Company GAP PAD TGP 3000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides, allowing for ease of use, and the top side has minimal tack for ease of handling.