Ohmite C2 Heat Sinks offer low-profile large surface areas and configurable heat sinks with a slide-in clip for TO-247 and compatible packages. Ohmite C2 can be through-hole soldered onto PCBs. These heat sinks are ideal for small-size, light-weight, compact (1U or 2U) electronic packaging with forced or natural convection cooling. The series provides 2.8°C/W or 3.2°C/W thermal resistance and 40W power dissipation for a single device.