Chip Quik Sn60/Pb40 BGA Solder Sphere

Chip Quik Sn60/Pb40 BGA solder sphere is made from pure materials to meet or exceed the demands of building or repairing BGA packages. This BGA solder sphere also exceeds MIL and IPC standards for purity levels and size tolerances. The solder sphere is a metal alloy of Tin and Lead with a melting point range of 183°C to 188°C. This solder sphere is compliant with conflict minerals and conforms to J-STD-006C, amendments 1 and 2 (solder alloys and fluxed/non-fluxed solders) industry standards.