LeaderTech TGN Ultra-Thin Thermal Pads

LeaderTech TGN Ultra-Thin Thermal Pads feature low thermal resistance and are fabricated by combining graphene and silicone. These materials are arranged in the polymer matrix in a precise manner, forming a good thermally conductive path that significantly improves the efficiency of heat conduction. The TGN series offers a -40°C to +150°C operating temperature range and a short-term operating temperature of +260°C for 30 minutes. LeaderTech TGN Ultra-Thin Thermal Pads have high resiliency and low density, making them suitable for the replacement of thermal grease material. Applications include graphic processors, base stations, microprocessors, and telecommunications.

Features

  • Low density
  • Low thermal impedance
  • Good thermal stability
  • Ultra-thin design
  • Fabricated by combining graphene and silicone
  • Can replace thermal grease material

Applications

  • Graphic processors
  • Base stations
  • Microprocessors
  • Data centers

Specifications

  • Storage conditions
    • Store in dark environment
    • ≤+30°C storage temperature
    • ≤+70% storage humidity
  • 2-year shelf life at storage conditions
  • +260°C short-term operating temperature for 30 minutes
  • -40°C to +150°C operating temperature range

Properties Chart

LeaderTech TGN Ultra-Thin Thermal Pads

Thermal Impedance

LeaderTech TGN Ultra-Thin Thermal Pads

Compression Ratio

LeaderTech TGN Ultra-Thin Thermal Pads

LeaderTech TGN Ultra-Thin Thermal Pads