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STMicroelectronics LSM6DSO32XTR iNEMO Inertial Module is a 3D digital accelerometer and 3D digital gyroscope system-in-package (SIP), with a digital I2C, SPI, and MIPI I3CSM serial interface standard output, performing at 0.55mA in combo High-Performance mode. Thanks to the ultra-low noise performance of both the gyroscope and the accelerometer, the device combines always-on low-power features with superior sensing precision for an optimal motion experience in wearable, hard-fall detection, navigation, and asset tracking applications. The accelerometer features smart sleep-to-wake-up (Activity) and return-to-sleep (Inactivity) functions that allow advanced power saving.
The LSM6DSO32XTR can be configured to generate interrupt signals by using hardware recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, and wake-up events.
The availability of a dedicated connection mode to external sensors allows the implementation of the sensor hub functionality.
The LSM6DSO32X is compatible with the requirements of the leading OSs offering real, virtual, and batch-mode sensors. It has been designed to implement in hardware significant motion, relative tilt, pedometer functions, timestamp, and provides a high level of customization. Up to 16 embedded finite state machines can be programmed independently for motion detection or gesture recognition such as hard-fall, glance, absolute wrist tilt, shake, double-shake, or pick-up.
The LSM6DSO32X also embeds Machine Learning Core logic, which allows identifying if a data pattern matches a user-defined set of classes. A typical example of an application could be activity detection like running, walking, or driving.
The LSM6DSO32X has an integrated smart first-in-first-out (FIFO) buffer of up to 9kbyte in size, allowing dynamic batching of significant data.
The STMicroelectronics LSM6DSO32XTR iNEMO Inertial Module is available in a small plastic Land Grid Array (LGA) package and it is guaranteed to operate over an extended temperature range from -40°C to +85°C. The ultra-small size and weight of the SMD package make it an ideal choice for handheld portable applications such as smartphones, IoT-connected devices, and wearables or any other application where reduced package size and weight are required.
