STMicroelectronics LSM6DSV iNEMO™ Inertial Module

STMicroelectronics LSM6DSV iNEMO™ Inertial Module is a system-in-package featuring a 3-axis digital gyroscope and a 3-axis digital accelerometer. It has a triple core for processing acceleration and angular rate data on three separate channels with dedicated configuration, filtering, and processing. The LSM6DSV boosts performance at 0.65mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer. The device embeds advanced dedicated features such as a finite state machine and data filtering for OIS, EIS, and motion processing.

The LSM6DSV supports main OS requirements, offering real, virtual, and batch mode sensors. In addition, the LSM6DSV can efficiently run the sensor-related features specified in Android, saving power and enabling faster reaction time. In particular, the LSM6DSV has been designed to implement hardware features such as significant motion detection, stationary/motion detection, tilt, pedometer functions, and timestamping to support the data acquisition of external sensors.

The LSM6DSV offers hardware flexibility to connect the pins with different mode connections to external sensors to expand functionalities such as adding a sensor hub, auxiliary SPI, etc. The LSM6DSV offers advanced design flexibility for OIS and EIS applications. Both channels have a dedicated processing path with independent filtering and enhanced EIS channel gyroscope data that are read over the primary interfaces I2C/ MIPI I3C® v1.1/SPI.

The STMicroelectronics LSM6DSV is available in a small plastic land grid array (LGA) package of 2.5mm x 3.0mm x 0.83 mm to address ultra-compact solutions.

Features

  • Triple core for UI, EIS, and OIS data processing
  • Power consumption of 0.65mA in combo high-performance mode
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 4.5KB
  • Android compliant
  • ±2/±4/±8/±16g full scale
  • ±125/±250/±500/±1000/±2000/±4000dps full scale
  • 1.71V to 3.6V analog supply voltage 
  • Independent IO supply (extended range: 1.08V to 3.6V)
  • 2.5mm x 3mm x 0.83mm compact footprint 
  • SPI/I2C and MIPI I3C® v1.1 serial interface with main processor data synchronization
  • Auxiliary SPI for OIS data output for gyroscope and accelerometer
  • OIS configurable from aux SPI, primary interface (SPI/I2C and MIPI I3C® v1.1)
  • EIS dedicated channel on the primary interface with dedicated filtering
  • Advanced pedometer, step detector, and step counter
  • Significant motion detection, tilt detection
  • Standard interrupts (free-fall, wake-up, 6D/4D orientation, click and double-click)
  • A programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with a high rate @ 960Hz
  • Embedded temperature sensor
  • ECOPACK and RoHS compliant

Applications

  • Motion tracking and gesture detection, augmented reality (AR) / virtual reality (VR) / mixed reality (MR) applications
  • Wearables
  • Indoor navigation
  • IoT and connected devices
  • Smartphones and handheld devices
  • EIS and OIS for camera applications
  • Vibration monitoring and compensation

Resources

  • Brochures
    • MEMS and Sensors Quick Reference Guide
    • MEMS and Sensors Smart Motion Tracking, IoT, and Enhanced User Experience
    • Sensor and Motion Algorithm Software Pack for STM32Cube
    • Smart Motion tracking, IoT For An Enhanced User Experience
  • Application Notes
    • Finite State Machine
    • Machine Learning Core
    • Always-on 3D Accelerometer and 3D Gyroscope
  • Design Tips
    • Surface Mounting Guidelines for MEMS Sensors in an LGA Package
    • 1-Point or 3-Point Tumble Sensor Calibration
    • Noise Analysis and Identification in MEMS Sensors
    • Residual Linear Acceleration by Gravity Subtraction to Enable Dead-Reckoning

Videos

STMicroelectronics LSM6DSV iNEMO™ Inertial Module