Amphenol Commercial Multi-Trak™ High-Speed Interconnect Solution

Amphenol Commercial Multi-Trak™ High-Speed Interconnect Solution features next-generation 0.60mm-pitch connectors with a slim form factor design. These connectors transmit high-speed signals up to 56G PAM4/PCIe® Gen 5 and target to meet 64G PAM4/PCIe Gen 6. This allows greater signal path lengths while maintaining signal integrity (SI) performance compared to conventional PCB routing methods. The vertical configurations combine the original PCIe and MCIO to be one connector to include power and high-/low-speed signals. Amphenol Commercial Multi-Trak™ High-Speed Interconnect Solution is designed to be cost-effective, highly modular, scalable, and easy to repair. The Multi-Trak series is ideal for communications and data applications, including commercial systems, networking, and high-end computing systems.

Features

  • High-speed – 56Gb/s PAM4/PCIe® Gen 5 capability
  • Supports both cable and card edge connections
  • Supports power solutions with DIP type for a total of 21A
  • Meets OCP DC-MHS and SFF-TA-1033 specifications
  • Over 1m transmission distance
  • Variety of plugs to support different routing requirements
  • 0.60mm-pitch vertical configurations combine original PCIe and MCIO to be one connector, includes power and high-/low-speed signals
  • Modularized design for further expansion, card, and cable interactive support

Applications

  • Communications
    • Baseband
    • Commercial systems
    • Networking
    • Radio units
  • Data
    • High-end computing system
    • Server and storage systems

Amphenol Commercial Multi-Trak™ High-Speed Interconnect Solution