STMicroelectronics A1F25M12W2-F1 ACEPACK 1 Power Module

STMicroelectronics A1F25M12W2-F1 ACEPACK 1 Power Module incorporates a four-pack topology with NTC and Gen 2 technology, advanced silicon carbide MOSFETs. The STM A1F25M12W2-F1 modular solution can be used to discover complex topologies represented by high power density to meet the highest efficiency requirements. The A1F25M12W2-F1 device is ideal for welding, DC/DC converter, and high-frequency switching applications.

Features

Fourpack topology:
- 1200V SiC MOSFET
- R_DS(on) typical 25mΩ
- Very high-power density
- Very low switching energies
Switching characteristics almost independent of temperature

ACEPACK 1 power module:
- DBC Cu-Al₂O₃-Cu based
- Insulation voltage UL certified of 2.5kVrms
- Press-fit contact pins
- Integrated NTC temperature sensor

Applications

DC/DC converters
High-frequency switching
Welding

STMicroelectronics A1F25M12W2-F1 ACEPACK 1 Power Module

Features

Applications

Typical Application Circuit

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