Amphenol FCI COM-HPC Board-to-Board Connectors

Amphenol FCI COM-HPC Board-to-Board Connectors feature a pair of 0.635mm pitch connectors with 400 pin positions. The connectors provide plug and receptacle assemblies that support 5mm and 10mm stack heights. The COM-HPC series addresses performance demands and increased bandwidth needs in server applications. The connectors deliver up to PCIe Gen5 32Gb/s SI performance and can handle Intel^® Core processors. The connectors can store one terabyte of memory via eight DIMM sockets. Amphenol FCI COM-HPC Board-to-Board Connectors support a 150W max CPU power and are ideal for datacom, 5G wireless infrastructure, industrial embedded computing, medical, and military applications.

Features

Plug and receptacle assemblies
Supports 5mm (1016347914340T1L) and 10mm (1016347914840T1L) stack heights
High bandwidth, up to 32Gb/s per channel
Supports CPU power at 150W
Designed to handle Intel Core processors
Stores one terabyte of memory via eight DIMM sockets

Increased pin count
Ensures secure connection
Withstands 100G mechanical shock
High un-mating force
Lead-free
RoHS compliant

Applications

Datacom
5G wireless infrastructure
Industrial embedded computing

Medical
Military

Specifications

Copper alloy terminal material
Glass-filled, high-temperature resin housing
10μin min Au on contacts over 50μin min
1.2A current rating per contact
150V_AC operating voltage rating
>5000MΩ insulation resistance

120N max mating force rating
80N un-mating force rating
25-cycle durability
EIA-364-32 thermal shock rated
EIA-364-27 mechanical shock rated
-55°C to +125°C operating temperature range

Amphenol FCI COM-HPC Board-to-Board Connectors

Features

Applications

Specifications

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