Amphenol FCI DensiStak™ Board-to-Board Connectors

Amphenol FCI DensiStak™ Board-to-Board Connectors are high-density connectors with a dual-beam contact system to ensure reliable performance. The connectors feature an 11-row design with up to 1034 pin positions and an open-pin field design for added flexibility. The DensiStak connectors offer high-speed performance of up to 16Gb/s and meet PCIe^® Gen 4, Ethernet, USB, DP, and MIPI protocols. The Amphenol FCI DensiStak Board-to-Board Connectors are constructed with a UL 94V-0-rated housing material that can withstand harsh environments. The connectors are RoHS and USCAR-2 compliant, ideal for automotive applications, including Advanced Driver Assistance Systems (ADAS). The DensiStak devices are also suitable for servers, data storage, artificial intelligence (AI), industrial, and sensing/instrumentation applications.

Features

High density up to 1034 positions
11 rows
Open-pin field design for added flexibility
High speed up to PCIe Gen 4 with 16Gb/s
Dual-beam contact system ensures reliable use

0.8mm x 1.25mm compact size
Surface-mount soldering tails
USCAR-2 compliant for automotive applications
UL 94V-0-rated housing withstands harsh environments
Halogen- and lead-free, RoHS compliant

Applications

Automotive
ADAS
Servers
Data storage

AI
Industrial
Sensing and instrumentation

Specifications

Copper alloy terminals and shield
0.2N max contact mating
0.16N max contact unmating
50- to 500-cycle durability per plating option
SAE/USCAR-2 V2 mechanical shock/vibration rating
0.8A current rating per contact

4A current rating per shield spring
100mΩ insulation resistance
100V_AC/DC voltage rating
40mΩ max contact LLCR
5mΩ max shield LLCR
-55°C to +125°C operating temperature range

Amphenol FCI DensiStak™ Board-to-Board Connectors

Features

Applications

Specifications

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